BioInkSense™ D110 UV-Curable Dielectric Ink

Price range: $89.00 through $2,999.00

Premium UV-curable screen-printable dielectric insulating ink engineered for rapid manufacturing of multilayer printed electronics, flexible circuits, wearable biosensors, RFID devices, and high-throughput industrial printed electronic systems.

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Description

Description

BioInkSense™ D110 UV-Curable Dielectric Ink

BioInkSense™ D110 is a premium UV-curable dielectric insulating ink specifically engineered for high-speed manufacturing of multilayer printed electronics and electrochemical sensing devices. The advanced UV-polymer formulation enables instantaneous curing upon UV exposure, eliminating thermal curing requirements while providing exceptional electrical insulation, outstanding mechanical durability, superior chemical resistance, and excellent print definition.

The proprietary UV chemistry significantly increases manufacturing throughput while minimizing substrate deformation and energy consumption. D110 is ideally suited for high-volume production of electrochemical biosensors, flexible printed electronics, wearable devices, RFID antennas, microfluidic cartridges, and multilayer printed circuit architectures where rapid processing and dimensional stability are essential.

The formulation is compatible with manual prototyping, automated screen printing, and industrial roll-to-roll UV manufacturing systems.

Technical Specifications

Property Typical Value
Ink chemistry UV-curable dielectric polymer
Printing method Screen printing
Mesh compatibility 250–420 mesh
Recommended emulsion thickness 10–25 μm
Wet film thickness 15–35 μm
Cured film thickness 8–20 μm
UV wavelength 365–405 nm
UV dose 600–1200 mJ/cm²
Cure time 2–10 seconds
Solid content 98–100 wt%
Viscosity (25°C) 9,000–22,000 cP
Density 1.10–1.35 g/cm³
Color White
Finish Semi-gloss
Shelf life 12 months
Storage temperature 4–25°C

Electrical Performance

Parameter Typical Value
Dielectric strength >45 kV/mm
Volume resistivity >10¹⁴ Ω·cm
Surface resistivity >10¹³ Ω/sq
Dielectric constant (1 MHz) 3.0–3.5
Dissipation factor <0.025
Insulation resistance >10¹² Ω
Breakdown voltage >1,200 V
Leakage current <1 nA

Mechanical Performance

Parameter Typical Value
Pencil hardness 3H
Tape adhesion ASTM D3359 Class 5B
Flexibility Excellent
Minimum bending radius <2 mm
Abrasion resistance Excellent
Moisture resistance Excellent
Chemical compatibility PBS, serum, saliva, sweat, IPA, ethanol, laboratory buffers

Compatible Substrates

  • PET
  • Polyester
  • Polycarbonate
  • Polyimide
  • Paper
  • Glass
  • Ceramic
  • Flexible polymer films
  • Surface-treated plastics

Manufacturing Compatibility

  • Manual screen printing
  • Semi-automatic screen printing
  • Fully automatic screen printing
  • UV roll-to-roll manufacturing
  • High-speed sheet-fed production

Typical Applications

  • Multilayer printed electronics
  • UV-manufactured flexible circuits
  • Electrochemical biosensors
  • Wearable electronics
  • RFID and NFC devices
  • Diagnostic cartridges
  • Microfluidic devices
  • Printed medical electronics
  • Flexible displays
  • Industrial printed electronics

Quality Assurance

Each production batch undergoes comprehensive quality control including rheological characterization, UV curing validation, dielectric strength testing, insulation resistance verification, adhesion testing, printability assessment, chemical resistance evaluation, visual inspection, and batch-to-batch reproducibility analysis.

Available Documents

  • Technical Data Sheet (TDS)
  • Safety Data Sheet (SDS)
  • UV Printing Guide
  • Storage and Handling Guide
  • Certificate of Analysis (available upon request)

Ordering

Select the desired package size and quantity from the purchase options above. Product pricing and availability are updated automatically based on the selected package size.

Additional information

gram

10 g, 25 g, 50 g, 100 g, 250 g, 500 g