BioInkSense™ S100 Silver Conductive Ink

Price range: $119.00 through $4,499.00

Premium screen-printable silver conductive ink engineered for ultra-high electrical conductivity, excellent adhesion, and reliable fabrication of printed electronics, biosensors, RFID antennas, flexible circuits, and wearable electronic devices.

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Description

Description

BioInkSense™ S100 Silver Conductive Ink

BioInkSense™ S100 is a premium silver conductive ink formulated with high-purity micron-sized silver particles dispersed within an advanced polymer binder system. The formulation provides exceptional electrical conductivity, outstanding printability, excellent substrate adhesion, and long-term environmental stability for research, prototyping, and industrial manufacturing.

The optimized rheology enables uniform screen printing while maintaining excellent edge definition and consistent film thickness. After curing, S100 forms highly conductive silver traces with excellent flexibility and mechanical durability. The ink is suitable for fabrication of conductive tracks, interconnects, electrodes, RFID antennas, flexible printed circuits, wearable electronics, and electrochemical biosensors.

The formulation is compatible with both laboratory-scale prototyping and high-volume roll-to-roll manufacturing.

Technical Specifications

Property Typical Value
Ink chemistry Micron silver particle composite
Printing method Screen printing
Mesh compatibility 250–420 mesh
Recommended emulsion thickness 10–20 μm
Wet film thickness 10–25 μm
Cured film thickness 5–12 μm
Recommended curing temperature 100–130°C
Recommended curing time 10–20 min
Solid content 75–85 wt%
Viscosity (25°C) 10,000–25,000 cP
Particle size (D90) <8 μm
Density 2.8–3.5 g/cm³
Shelf life 12 months
Storage temperature 4–25°C

Electrical Performance

Parameter Typical Value
Sheet resistance <0.025 Ω/sq @ 10 μm cured film*
Volume resistivity <8 × 10⁻⁶ Ω·cm*
Conductivity >2.0 × 10⁷ S/m
Batch-to-batch conductivity variation <2%
Print-to-print reproducibility CV <2%
Contact resistance variation <2%
Adhesion ASTM D3359 Class 5B
Electrical stability >99% conductivity retained after 5,000 bending cycles

*Measured under recommended printing and curing conditions.

Mechanical Performance

Parameter Typical Value
Minimum bending radius <3 mm
Flexibility Excellent
Tape adhesion ASTM D3359 Class 5B
Abrasion resistance High
Chemical compatibility PBS, serum, sweat, aqueous buffers, IPA

Compatible Substrates

  • Polyethylene terephthalate (PET)
  • Polyester
  • Polycarbonate
  • Polyimide
  • Glass
  • Ceramic
  • Flexible polymer films
  • Surface-treated plastics

Manufacturing Compatibility

  • Manual screen printing
  • Semi-automatic screen printing
  • Fully automatic screen printing
  • Roll-to-roll manufacturing
  • Sheet-fed production

Typical Applications

  • Printed electronics
  • Flexible circuits
  • RFID antennas
  • NFC antennas
  • Conductive tracks
  • Biosensors
  • Wearable electronics
  • Touch sensors
  • Membrane switches
  • Printed heaters

Quality Assurance

Each production batch undergoes comprehensive quality control including silver particle distribution analysis, rheological characterization, electrical conductivity testing, adhesion testing, printability verification, visual inspection, and batch-to-batch reproducibility analysis.

Available Documents

  • Technical Data Sheet (TDS)
  • Safety Data Sheet (SDS)
  • Printing Guide
  • Storage and Handling Guide
  • Certificate of Analysis (available upon request)

Ordering

Select the desired package size and quantity from the purchase options above. Product pricing and availability are updated automatically based on the selected package size.

Additional information

gram

10 g, 25 g, 50 g, 100 g, 250 g, 500 g