BioInkSense™ S130 Low-Temperature Curing Silver Conductive Ink

BioInkSense™ S130 Low-Temperature Curing Silver Conductive Ink

Price range: $109.00 through $4,739.00

Premium low-temperature curing silver conductive ink engineered for heat-sensitive substrates, flexible electronics, wearable biosensors, and printed electronic devices requiring excellent conductivity at curing temperatures below 90°C.

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Description

Description

BioInkSense™ S130 Low-Temperature Curing Silver Conductive Ink

BioInkSense™ S130 is a premium screen-printable silver conductive ink specifically engineered to achieve exceptional electrical conductivity at significantly reduced curing temperatures. The proprietary formulation combines highly conductive silver particles with an advanced low-temperature polymer binder, enabling fabrication of high-performance conductive circuits on temperature-sensitive materials without compromising electrical performance.

The low-temperature curing chemistry minimizes thermal stress on flexible polymer substrates while maintaining excellent adhesion, fine-line printability, and long-term electrical stability. S130 is ideally suited for wearable electronics, flexible biosensors, disposable diagnostic devices, smart packaging, printed RFID antennas, and next-generation flexible electronic systems where conventional curing temperatures are unsuitable.

The formulation supports both rapid laboratory prototyping and industrial roll-to-roll manufacturing.

Technical Specifications

Property Typical Value
Ink chemistry Low-temperature silver particle composite
Printing method Screen printing
Mesh compatibility 250–420 mesh
Recommended emulsion thickness 10–20 μm
Wet film thickness 10–25 μm
Cured film thickness 5–12 μm
Recommended curing temperature 60–90°C
Recommended curing time 10–15 min
Solid content 74–84 wt%
Viscosity (25°C) 9,000–22,000 cP
Particle size (D90) <6 μm
Density 2.8–3.5 g/cm³
Shelf life 12 months
Storage temperature 4–25°C

Electrical Performance

Parameter Typical Value
Sheet resistance <0.020 Ω/sq @ 10 μm cured film*
Volume resistivity <7 × 10⁻⁶ Ω·cm*
Conductivity >2.4 × 10⁷ S/m
Batch-to-batch conductivity variation <2%
Print-to-print reproducibility CV <2%
Contact resistance variation <2%
Adhesion ASTM D3359 Class 5B
Electrical stability >99% conductivity retained after 8,000 bending cycles

*Measured under recommended printing and curing conditions.

Mechanical Performance

Parameter Typical Value
Minimum bending radius <2 mm
Flexibility Excellent
Tape adhesion ASTM D3359 Class 5B
Abrasion resistance High
Chemical compatibility PBS, serum, saliva, sweat, aqueous buffers

Compatible Substrates

  • PET
  • TPU
  • Polyurethane
  • Polycarbonate
  • Polyester
  • Polyimide
  • Paper
  • Flexible polymer films

Manufacturing Compatibility

  • Manual screen printing
  • Semi-automatic screen printing
  • Fully automatic screen printing
  • Roll-to-roll manufacturing
  • Sheet-fed production

Typical Applications

  • Flexible biosensors
  • Wearable electronics
  • Disposable diagnostic devices
  • Smart packaging
  • RFID and NFC antennas
  • Printed circuits
  • Flexible medical devices
  • Stretchable electronics
  • Printed heaters
  • Flexible electronic interconnects

Quality Assurance

Each production batch undergoes comprehensive quality control including rheological characterization, silver particle distribution analysis, low-temperature curing verification, electrical conductivity testing, adhesion testing, printability assessment, visual inspection, and batch-to-batch reproducibility analysis.

Available Documents

  • Technical Data Sheet (TDS)
  • Safety Data Sheet (SDS)
  • Printing Guide
  • Storage and Handling Guide
  • Certificate of Analysis (available upon request)

Ordering

Select the desired package size and quantity from the purchase options above. Product pricing and availability are updated automatically based on the selected package size.

Additional information

gram

10 g, 25 g, 50 g, 100 g, 250 g, 500 g

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